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In general, the LED epitaxial production after completion of her main performance has already set, chip manufacturing does not produce the 甞 nuclear nature to change, but in the process of coating, alloying inappropriate bad conditions can cause some electrical parameters.For example, low or high alloying temperature will cause poor ohmic contact, and poor ohmic contact is the main reason for high positive pressure drop VF in chip manufacturing.After cutting, if the chip edge of some corrosion process, to improve the reverse chip leakage will have a better help.This is because after cutting with the diamond grinding wheel blade, there will be a lot of debris powder left on the edge of the chip. If these particles stick to the PN junction of the LED chip, it will cause electricity leakage and even breakdown.In addition, if the chip surface photoresist stripping is not clean, will cause the front welding wire and virtual welding and so on.If it is the back side, the pressure drop will also be higher.In the process of chip production, the light intensity can be increased by means of surface coarsening and inverted trapezoidal structure.
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